| SSD CHIP | 8D |
| Max | 512 GB |
| PKG thickness | 1.2 mm |
| Development | Mass production （yield 98.5%）
|
Advantage:
1. sDBG process with 30um thickness for 12 inch wafer.
2. 8D/16D die stack capability.
3. Copper pillar chip with flip chip capability.
Advantage:
1. Capability of SiP package design in house
2. Totally tunkey solution : SMT + Packaging + Testing + Module assembly
3. Rich experience at SiP manufacturing
