Test Machine Capability
Available Automatic Tester: Category | Vendor | Model No. | Application Products |
Advantest | H5620 | DDR3, DDR4, LPDDR4 | |
Advantest | HSM8G | DDR4, LPDDR4, DDR5, LPDDR5 | |
Advantest | T5503HS2 | DDR4, LPDDR4, DDR5, LPDDR5 | |
Advantest | T5503HS | DDR3, DDR4, LPDDR3, LPDDR4 | |
Advantest | T5503A | DDR3, eMCP(LPDDR2/3) | |
Advantest | T5588 | DDR3, DDR4, eMCP(LPDDR2), MCP(LPDDR2/NAND), LPDDR4 | |
Advantest | T5593 | eMCP(LPDDR2) | |
DI | AF8652 | DDR3, DDR4, eMCP, eMMC | |
HonTech | HT3309 | eMMC/eMCP Flash | |
HonTech | HT3350 | SSD | |
Logic & Mixed-signal | Chroma | 3380D | Logic & Mixed-signal |
Category | Vendor | Model No. | Application Products |
Final Test | Advantest | M6242 | BGA, CSP, LGA, TSOP |
Advantest | M6542 | BGA, CSP, LGA, TSOP | |
Techwing | TW350H | BGA, CSP, LGA, TSOP | |
Payton(In-house) | PH01 | Strip of LGA/BGA |
FT Engineering Capability
● Could provide test solution and convert test program with customer's cooperation.
● Could provide correlation analysis to meet customer requirement.
● Could provide abnormal lot EFA and PFA to confirm failure mode.
● Our automation system to prevent from human error and enhance test productivity.
● Could provide DRAM validation service.
Design Capability
● Burn-in Board Design
● Socket Design
● ATE Hi-Fix Design
● Changover kit