● Wafer BSG:
    Wafer size: 12 inch
    Wafer thickness: min 30um

BSG thickness tolerance: +/-3um

● Wafer Dicing:
    Dicing method: Blade, Laser

● Die Bonding
    Die Size: min 0.2mm*0.2mm
    Adhesive materials: Glue, DAF, FOW
    Die stack capability: 2D, 4D, 8D, 16D
    Die Bonding accuracy: +/-15um

● Wire Bonding
    Bond pad pitch: min 45um
    Bond pad size: min 40um
    Wire loop: min 30um
    Gold wire diameter: 15um, 17.5um, 20um
    Silver wire diameter: 17.5um, 19um
    Wire Bonding accuracy: +/-2um

● Molding: Transfer Molding and Compression Molding
    Mold Cap height: 300um to 1000um

● Laser Marking:
    Marking type: green laser and red laser
    Marking depth: max 50um
    2D marking capability to the individual IC

● Ball Mounting:
    Ball pitch：min 0.3 mm
    Ball size：min 0.2 mm